Summary:

Provide power module package/assembly total solution; include but not limited to module design review, assembly process development, TRA and handle the module relevant qualification.

提供电源模块封装/制造整体解决方案；包括但不限于模块设计审查、封装工艺开发、技术风险评估以及和电源模制造块相关事务的资格认证，等等.

RESPONSIBILITIES:

1.Power module package/assembly design rule and roadmap development;

电源模块封装/组件设计规则和路线图开发;

2.Review the packaging drawings and assure them to meet the design rules, include package outline, EQ list, build kit, PCB/SUB drawing, etc;

审核封装图纸，确保其符合设计规则，封装尺寸、设备清单、工治具、PCB/SUB 图纸等；

3.DFM/TRA review of power module designs with related subcons;

负责对相关的供应商对于电源模块设计的DFM/TRA进行审查；

4.Work with design team, assembly house, SMT site, material vendor to develop and qualify new materials and new assembly processes;

与设计团队、封装厂、SMT 现场、材料供应商合作，开发和导入新材料和新的封装工艺;

5.Coordinate with internal team to identify the module package related issues, addresses the root cause and find the solution;

通过协调内部资源分析电源模块相关问题，解决根本原因并找到解决方案;

6.Sum up the experience of module package design, SMT process and maintain the design rule;

总结模块封装设计、SMT 工艺和维护设计规则的经验;

7.Perform other assigned tasks as needed;

领导安排的其他工作;

REQUIREMENTS:

1.Hands on experience on PCB/SUB design in SMT or PCB factory;

具有在 SMT 或 PCB 工厂进行 PCB/SUB 设计的实际经验;

2.Familiar with AutoCAD, or PCB Designer Standard, CAM350 or Cadence software;

熟悉 AutoCAD 或 PCB Designer Standard、CAM350 或 Cadence 软件;

3.Good knowledge of SMT,Underfill,Mold,laser marking，Singulation, backgrinding,and PCB process;

熟悉 SMT、点部填充、封装、镭射、分板 背磨和 PCB制程工艺;

4.Bachelor degree with 5 years direct related experience.

本科学历，5 年以上直接相关工作经验。